XMS3 DHX Series - Cool DDR3! Sporting Corsair’s signature fin memory heat sink and patented heat-removing printed circuit board design, the new XMS3 DHX products feature DDR3 performance while promoting increased stability. DHX technology allows this memory to have superior thermal characteristics to enable it to run cooler than a module with stamped or mesh heat spreaders. The result is enabled superior reliability, stability and performance capability.

Corsair’s Unique Dual-path Heat Xchange (DHX) Solves the Problem - Corsair’s engineers have developed a unique technology that maximizes heat dissipation while improving reliability, even in the most extremely overclocked memory module. Dual-Path Heat Exchange (DHX) technology utilizes two methods to effectively remove heat from the memory circuit board - Convection and Conduction.

Speed	1600Mhz
Size	2 x 2GB
Latency	9-9-9-24
Model	Corsair TW3X4G1600C9DHX